位松，男，河北石家庄人，2020年4月毕业于中国科学技术大学/中国科学院金属研究所，工学博士。2020年5月入职太阳成集团tyc122cc，现为机电工程学院电子封装技术专业教师，电子信息材料与器件教育部工程研究中心成员，硕士生导师。长期从事电子封装热管理材料和宽禁带半导体先进封装技术研究。现主持国家自然科学基金青年基金、中国博士后科学基金、广西自然科学青年基金、广西科技基地和人才专项等项目。发表SCI、EI收录论文10篇，中国发明专利授权1项。

欢迎机械、材料或电气等相关学科专业，对工程技术领域感兴趣以及对学科知识具有好奇心的考生报考。

1. 2013.09 - 2020.04，中国科学技术大学，材料科学与工程学院，硕博连读/博士

2. 2009.09 - 2013.06，重庆科技学院，冶金与材料工程学院，本科/学士

1. 2020.05 - 至今，太阳成集团tyc122cc，机电工程学院，校聘副教授

2. 2021.06 - 至今，太阳成集团tyc122cc，机电工程学院，硕士研究生导师

[1]   Zenghuang Zheng, Song Wei*, Yiren Yang, Dan Zhang, Daoguo Yang, Wangyun Li, Jingdong Guo. Low-temperature solidifiable liquid metal with ultrahigh thermal conductivity enabled by spontaneous phase transition for electronics' safety and long-life cooling. Advanced Engineering Materials, 2023.

[2]  Wei, S., Wang, W., Zhou, L., Guo, J. Improving the Heat Conduction and Mechanical Properties of Thermal Interface Materials by Constructing Diphase Continuous Structure Reinforced by Liquid Metal. Composites Part A 2022, 162, 107149.

[3]   Xingmin Li, Jian Wang, Hongbo Qin, Siliang He, Wangyun Li, Song Wei*. Creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints with increasing current density. Journal of Materials Science: Materials in Electronics, 2022, 33, 16167–16182.

[4]   周丽君, 位松, 郭敬东, 孙方远, 王新伟, 唐大伟. 基于飞秒激光时域热反射法的微尺度 Cu-Sn 金属间化合物热导率研究 [J]. 金属学报, 2022, 58(12), 1645-1654. (共一)

[5]   S. Wei, Z.F. Yu, L.J. Zhou, J.D. Guo. Investigation on enhancing the thermal conductance of gallium-based thermal interface material using Cr-coated diamond particles. Journal of Materials Science: Materials in Electronics, 30 (2019): 7194-7202.

[6]   Z.F. Yu, S. Wei, J.D. Guo. Fabrication of aligned carbon-fiber/polymer TIMs using electrostatic flocking method. Journal of Materials Science: Materials in Electronics, 30 (2019): 10233-10243.

[7]  S. Wei, H.C. Ma, J.Q. Chen, J.D. Guo. Extreme anisotropy of electromigration: Nickel in single-crystal tin. Journal of Alloys and Compounds, 687 (2016): 999-1003.

[8]  Yun, M., Zhang, K., Cai, M., Yang, Y., Feng, C., Wei, S.*, Zhang, G. Extraction, Optimization and Failure Detection Application of Parasitic Inductance for High-Frequency SiC Power Devices. The 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021, 1-5.

[9]  S. Wei, Z.F. Yu, L.J. Zhou, J.D. Guo. Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy. The 19th International Conference on Electronic Packaging Technology (ICEPT), 1333-1336.

[10]  L.M. Yin, S. Wei, Z.L. Xu. The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures. Journal of Materials Science: Materials in Electronics, 24 (2013): 1369-1374.

4. 广西科技基地和人才专项, 项目编号2020AC19068, 2020.01-2023.01, 10万元, 主持

1.    郭敬东, 位松, 周丽君. 基于低熔点金属\导热粒子复合导热网络的热界面材料及其制备方法. 授权专利号: CN108912683B, 2021-02-26.（中国发明专利，第一作者为导师）

2.    位松, 郑增煌. 一种能够低温固化的镓基液态金属热界面材料及其制备方法. 申请号: 202210558818.X（中国发明专利）

1、邮箱：swei2020@126.com 

2、地址：广西桂林市灵川县太阳成集团tyc122cc（花江校区）机电楼